Electronic device

ABSTRACT

An electronic device includes a base body, which has a top side and also an underside lying opposite the top side. The base body has connection locations at its underside. An electronic component is arranged at the base body at the top side of the base body. The base body has at least one side area having at least one point of inspection having a first region and second region. The second region is embodied as an indentation in the first region. The first and the second region contain different materials.

This patent application is a continuation of, and claims the benefit of,U.S. patent application Ser. No. 13/382,698, filed on Jan. 23, 2012,titled “Electronic Device,” which is a national phase filing undersection 371 of PCT/EP2010/058831, filed Jun. 22, 2010, which claims thepriority to German patent application 10 2009 032 253.1, filed Jul. 8,2009, each of which are incorporated herein by reference in theirentirety.

TECHNICAL FIELD

An electronic device and also an optoelectronic apparatus comprising anelectronic device are specified.

SUMMARY OF THE INVENTION

In one aspect, the invention specifies an electronic device which makesit possible to optically monitor the solder contact of electricalconnections of the device.

In accordance with at least one embodiment, the electronic devicecomprises a base body. By way of example, the base body can be an SMDhousing (surface mountable device). The base body has a top side andalso an underside lying opposite the top side.

A respective area formed by a part of the outer area of the base body isformed at the top side and the underside. In this case, the area at theunderside denotes that outer area of the base body which faces a contactcarrier, for example, a printed circuit board in the mounted state.

In accordance with at least one embodiment, the base body has connectionlocations at its underside. In this case, the connection locations ofthe device are provided for making electrical contact with the device.Preferably, the connection locations are externally accessible at anunderside of the device, wherein the underside of the device issimultaneously the underside of the base body. In other words,electrical contact can be made with the device at the underside of thedevice.

In accordance with at least one embodiment, an electronic component isarranged at the base body at the top side of the base body. Theelectronic component can be conductively connected, for example, to thearea at the top side of the base body. For this purpose, the electroniccomponent can be bonded, soldered, or electrically conductivelyadhesively bonded onto the area. The electronic component can be aradiation-receiving or a radiation-emitting semiconductor chip. By wayof example, the semiconductor chip is a luminescence diode chip such as,for instance, a light-emitting diode chip or a laser diode chip.

In accordance with at least one embodiment, the base body has at leastone side area having at least one point of inspection having a firstregion and a second region. The side areas are those areas of the devicewhich laterally enclose the area at the underside and extend, forexample, in a direction transversely with respect to the area. The sideareas extend from the underside to the top side and thus connect theareas at the top side and underside. The at least one point ofinspection is preferably externally accessible and freely visible, forexample, to an external observer. In this case “freely visible” meansthat the point of inspection can be optically monitored externally,without parts of the point of inspection being concealed or covered whenthe device is mounted on a contact carrier. In this context “region” isa surface which shapes and forms the side area at least in places.Preferably, the point of inspection is formed completely by the firstand the second region. In other words the point of inspection is part ofthe side area and is itself subdivided into two regions. The point ofinspection is a part of the side area which differs from the rest of theside area, for example, with regard to a material.

In accordance with at least one embodiment, the second region isembodied as an indentation in the first region. In other words the“indentation” is a depression which is, for example, a notch or anindented curve in the first region. The second region is laterallybordered by the first region at least in places. By way of example, thesecond region is completely enclosed by the first region.

In accordance with at least one embodiment, the first and the secondregion contain different materials. In this case, “different” means thatthe materials with which the first and the second region arerespectively formed are not identical. By way of example, the secondregion can differ from the first region by virtue of an additionalcoating.

In accordance with at least one embodiment of the electronic device, theelectronic device has a base body, which has a top side and also anunderside lying opposite the top side, wherein the base body hasconnection locations at its underside. An electronic component isarranged at the base body at the top side of the base body. Furthermore,the base body has at least one side area having at least one point ofinspection having a first region and a second region, wherein the secondregion is embodied as an indentation in the first region. The first andthe second region contain different materials.

In this case, the electronic device described here is based on theinsight, inter alia, that connection locations arranged at an undersideof an electronic device are not visible externally if the electronicdevice bears on a contact carrier, for example, a printed circuit board.The connection locations are then concealed by a base body of theelectronic device. By way of example, the connection locations thuscannot be monitored in respect of whether they are sufficiently wettedwith a connection material. Furthermore, it is not possible to ensurewhether the connection locations of the electronic device are alsoelectrically contact-connected and/or mechanically connected to thecontact carrier.

In order, then, to make the connection locations of the devicemonitorable with regard to sufficient wetting with the connectionmaterial, the device described here makes use of the concept of using abase body having at least one side area having at least one point ofinspection. The point of inspection has a first region and a secondregion.

If both the connection locations and the at least one point ofinspection are brought into contact with a connection material andsufficient wetting and physically/chemically stable connection betweenthe connection material and the point of inspection are manifested, thenthe connection locations are also sufficiently wetted with theconnection material and thus electrically and mechanically stablyconnected to a contact carrier, for example, after curing. Thus, if theelectronic device is applied on a contact carrier, then the points ofinspection enable, by means of visual monitoring, a statement to be madeas to whether the connection locations are likewise sufficiently wettedwith the connection material.

In accordance with at least one embodiment, the second region can bewetted with a connection material to a greater extent than the firstregion. That is to say that the connection material forms a strongerphysical and/or chemical bond with the second region than with the firstregion and the connection material therefore does not “bead off”, forexample, upon application to the second region. After curing, theconnection material is more strongly bonded to the second region, suchthat, for example, the bonding location between the connection materialand the second region withstands greater external mechanical loadingthan the bonding location between the connection material and the firstregion. The connection material can be a solder, for example. By way ofexample, the solder is then formed with a lead-free or lead-containingsoldering tin. It is likewise possible for the connection material to beformed with an adhesive. By way of example, the adhesive is a silverconductive adhesive.

In accordance with at least one embodiment, the base body has a metalliccarrier. The carrier can be a metallic carrier strip (also calledleadframe). By way of example, the carrier strip is then formed with twostrip-type metal strips. The metallic carrier can be formed with copper,for example. It is likewise possible for the metallic carrier to beformed with one or more of the materials nickel, palladium, silver or amixture of these materials together with copper.

In accordance with at least one embodiment, the metallic carrier iscovered by a radiation-opaque housing body in places. Preferably, themetallic carrier and the housing body then form the base body. In thiscontext, “covered” means that the housing body is in direct contact withthe metallic carrier in places and, therefore, neither a gap nor aninterruption is formed at the locations between the metallic carrier andthe housing body. In this case, “radiation-opaque” means that thehousing body is opaque to electromagnetic radiation impinging on it tothe extent of 80%, preferably to the extent of 90%. The housing body canbe formed with a thermosetting plastic material or thermoplasticmaterial, for example, an epoxide, or else be formed with a ceramicmaterial or consist of such a material. Additional radiation-absorbingmaterials, for example, carbon black particles or other fillers can beintroduced into the material.

In accordance with at least one embodiment, the housing bodymechanically connects the metallic carrier and the point of inspectionto one another. A device which is especially stable with respect toexternal mechanical effects, for example, is advantageously provided inthis way. Furthermore, the metallic carrier and the point of inspectioncan be stabilized in their position with respect to one another by meansof the housing body. Furthermore, the housing body is electricallyinsulating and arranged between the metallic carrier and the point ofinspection.

In accordance with at least one embodiment, the metallic carrier and/orthe point of inspection are/is at least partly embedded into the housingbody. That can mean that the metallic carrier is enclosed by the housingbody apart from the connection locations and a mounting region for theelectronic component. That is to say that the housing body preferablyencloses the connection locations of the device in a positively lockingmanner at least in places. Preferably, the connection locations thenterminate vertically flush with the housing body. In this case“vertically” denotes those directions which run in a plane extendingperpendicularly or substantially perpendicularly to the area at theunderside of the base body. That is to say that the connection locationsare situated at the underside of the base body and do not project beyondthe housing body. Preferably, the connection locations in this case havean area through which electrical contact can be made with them fromoutside the device. At least at the connection area, the connectionlocation is then not enclosed by the housing body.

In accordance with at least one embodiment, the connection locations andthe point of inspection are formed with the same material. By way ofexample, the connection locations and the point of inspection are formedwith copper, wherein the connection locations and the point ofinspection in the second region are then additionally provided with ametallic coating, for example, a gold or silver coating. If the point ofinspection is sufficiently wetted with the connection material in thesecond region, then this enables a statement to be made regarding thefact that, after the connection locations are additionally brought intocontact with the connection material, the connection locations are alsosufficiently wetted.

In accordance with at least one embodiment, the base body is formed witha ceramic material. If the base body is formed completely with a ceramicmaterial, then the area at the underside is coated at least in placeswith a material capable of making electrical contact, for example, ametal, wherein the coated locations then form the connection locations.Furthermore, the base body can then have chip connection locations andalso conductor tracks for making contact with the electronic component.

In accordance with at least one embodiment, the at least one side areaof the base body is produced by means of singulation in places. Inparticular, therefore, contour forms of the side area are not producedby a casting or pressing process, but rather by means of a process ofsingulation of the shaped body. The singulation can be effected, forexample, by means of sawing, cutting, milling or producing a breakingedge and subsequent breaking. The side area of the housing body is thusproduced by means of material removal. The side area then preferably hastraces of material removal. If the base body is formed with the metalliccarrier and if singulation, cutting or breaking is effected both throughthe housing body and through the metallic carrier during the productionof the electronic device, then the side areas of the metallic carrierterminate laterally flush with the housing body. In this case“laterally” denotes those directions which run in a plane extendingparallel or substantially parallel to the area at the underside. Theside area is then formed both by the housing body in places and by themetallic carrier in places. The locations of the carrier through whichsingulation is effected can then form the point of inspection.Preferably, during singulation, however, singulation is not effectedthrough the second region of the point of inspection, such that thesecond region has no traces of the singulation, for example, no tracesof material removal.

In accordance with at least one embodiment, the first region of thepoint of inspection is formed with a metal. It is conceivable in thiscontext for the base body to have a metallic carrier.

In accordance with at least one embodiment, the first region of thepoint of inspection is formed with a ceramic material. Preferably, thebase body is then also formed completely with a ceramic material.

In accordance with at least one embodiment, the second region of thepoint of inspection has a metallic coating. Preferably both theconnection locations and the second region of the point of inspectionare provided with a metallic coating. Preferably, the metallic coatingof the connection locations and of the second region of the point ofinspection is formed with the same material. The metallic coatingadvantageously enables a setting, for an example an increase of thewettability with the connection material. The metallic coating is, forexample, a layer formed preferably with silver or gold.

Furthermore, an optoelectronic apparatus comprising an electronic deviceis specified.

In accordance with at least one embodiment of the optoelectronicapparatus, the optoelectronic apparatus comprises the electronic devicein accordance with one of the preceding embodiments.

In accordance with at least one embodiment, the optoelectronic apparatushas a contact carrier, which serves for making electrical contact withthe electronic device, wherein at least one mounting region is formed ata surface of the contact carrier. The contact carrier can be a printedcircuit board, for example, wherein the mounting region is then thatregion on which the electronic device is mounted. The mounting region istherefore that region of the surface of the contact carrier which facesthe electronic device and on which the electronic device bears. For thispurpose, the mounting region can be in mechanical contact with theelectronic device at least in places. Preferably, the mounting region isin contact with the connection material via which electrical contact ismade with the electronic device. That is to say that the connectionmaterial then wets, at least in places, at least the connectionlocations of the device and therefore also parts of the mounting region.

In accordance with at least one embodiment the second region of thepoint of inspection is cohesively connected to the mounting region bymeans of the connection material. In this case, “cohesively” means thatafter curing of the connection material, the connection material forms afixed bond with the second region which fixed bond is stable and can beloaded, for example, even with respect to external mechanical loading.Preferably, the connection material then forms a physical and/orchemical bond with the material of the second region, such that neithera gap nor an interruption is formed between the connection material andthe second region. In particular, the connection material is connectedto the second region in a fracture-resistant manner.

In accordance with at least one embodiment, the points of inspection arefreely visible from the surface of the contact carrier. In this case,“freely visible” means that the point of inspection can be visuallymonitored from that side of the contact carrier which faces theelectronic device. By way of example, an external observer can thenmonitor the point of inspection with respect to whether the connectionmaterial is cohesively connected to the second region. If the secondregion of the point of inspection has been cohesively connected to theconnection material, then that means that the connection locations ofthe electronic device are also cohesively connected to the connectionmaterial.

In accordance with at least one embodiment, the material is a solder. Ifthe connection material is a soldering tin, then it is conceivable forthe second region of the point of inspection to be provided with asilver or a gold coating. Preferably, in the case of a gold coating, byway of example, onto the metallic carrier formed with copper, by meansof a deposition technique, for example, in an electroless fashion, anassemblage of a plurality of layers, for example, in the second regionof the point of inspection, is deposited onto the metallic carrier.Preferably, the assemblage follows the layer sequencenickel/palladium/gold proceeding from the metallic carrier in thedirection of the connection material. It is likewise conceivable for thelayer sequence of the assemblage to be formed with other materialsand/or to deviate from the layer sequence presented.

BRIEF DESCRIPTION OF THE DRAWINGS

The electronic device described here and also the optoelectronicapparatus described here will be explained in greater detail below onthe basis of exemplary embodiments and with reference to the associatedfigures.

FIGS. 1a, 1b, 2a, 2b, 2c and 4 show schematic views of exemplaryembodiments of an electronic device described here;

FIGS. 3 and 5 each show in schematic plan views a carrier assemblage forproducing an electronic device described here; and

FIG. 6 shows, in a schematic side view, an exemplary embodiment of anoptoelectronic apparatus described here.

In the exemplary embodiments and the figures, identical or identicallyacting constituent parts are in each case provided with the samereference symbols. The elements illustrated should not be regarded astrue to scale; rather, individual elements may be illustrated withdifferent sizes in order to afford a better understanding.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

FIG. 1a shows, in a schematic sectional illustration along a sectionalline A-A, of FIG. 2a , an exemplary embodiment of an electronic deviceEBT described here. A base body 100 has a top side 1A and also anunderside 1B lying opposite the top side.

Furthermore, the base body 100 has a metallic carrier 101. In this case,the metallic carrier 101 can be formed with copper, for example.Furthermore, the metallic carrier 101 is covered by a radiation-opaquehousing body 6 in places. The carrier 101 together with the housing body6 then forms the base body 100. In accordance with the exemplaryembodiment in FIG. 1a , the housing body 6 completely covers an area 1AFat the top side 1A of the base body 100 apart from a chip mountingregion. At the underside 1B of the base body 100, the housing body 6terminates laterally flush with connection locations A1, A2 of themetallic carrier 101. That is to say that an area 1BF at the underside1B of the base body 100 is planar and, consequently, has neitherelevations nor recesses nor interruptions and is determined solely bythe form of the base body 100.

The connection locations A1 and A2 serve for making electrical contactwith the electronic device EBT. The connection locations A1, A2 arefreely accessible from the underside 1B of the base body 100 and in thepresent case are coated with a material capable of making electricalcontact, for example, a silver or gold coating.

An electronic component 2 is arranged on the area 1AF formed in placesby the carrier 101. The electronic component 2 is electricallycontact-connected to the metallic carrier 101 by means of a bonding wirecontact-connection 21. The electronic component 2 can be aradiation-receiving or a radiation-emitting semiconductor chip. By wayof example, the semiconductor chip is a luminescence diode chip such as,for instance, a light-emitting diode chip or a laser diode chip.

Furthermore, the base body 100 has side areas 3 produced by means ofsingulation. The singulation can be effected, for example by means ofsawing, cutting, milling, producing a breaking edge and subsequentbreaking or some other form of material removal. The side areas 3 of thebase body 100 are then produced by means of material removal. The sideareas 3 then preferably have traces of material removal. Duringsingulation, it is then the case that singulation is effected boththrough the housing body 6 and through the metallic carrier 101, suchthat the side areas 3 are formed in places by the housing body 6 and themetallic carrier 101.

Each side area 3 has a point of inspection 4 having a first region 4Aand a second region 4B, wherein the second region is embodied as anindentation 5 in the first region 4A.

In order to make the second region 4B wettable with a connectionmaterial, the region 4B is provided with a metallic coating. By way ofexample, the metallic coating is a coating formed with silver or gold.The metallic coating of the region 4B is the same material with whichthe connection locations A1, A2 are also coated. In particular,singulation is not effected through the region 4B during singulation,such that the region 4B of the point of inspection 4 has no singulationtraces.

FIG. 1b describes, in a schematic sectional illustration, a furtherexemplary embodiment in accordance with an electronic device EBTdescribed here, wherein the metallic carrier 101 is formed with twocarrier parts 150 and 160 separated from one another. In this case, thecarrier part 150 has the point of inspection 4. The housing body 6 isarranged between the carrier parts 150 and 160. The housing body 6 iselectrically insulating and mechanically connects the two carrier parts150 and 160 to one another. What can advantageously be made possible inaccordance with this embodiment is that the carrier part 150 having thepoint of inspection 4 is utilized for making contact with further, forexample, external, electronic devices. In particular the presentexemplary embodiment makes it possible for the carrier part 160 and thecarrier part 150 to be at different electrical potentials and thus foran electrical voltage to be able to be formed between the two carrierparts 150 and 160.

FIGS. 2a, 2b, and 2c show, in schematic plan and side views and also inplan views from the underside, the exemplary embodiment in accordancewith FIG. 1a . The point of inspection 4 formed by the first region 4Aand the second region 4B can once again be discerned in each case. Thesecond region 4B is formed as an indentation 5 in the first region,wherein the indentation 5 is produced by means of a corner edge 31,formed by two side areas 3 in each case, in the form of a“cylinder-segment-like” depression. In this case,“cylinder-segment-like” means that the indentation 5 is formed by acontinuously curved inner area and also a corner inner area runningperpendicularly to the inner area.

FIG. 3 shows a metallic carrier assemblage 1000 in a schematic planview. In order to produce the base body 100, housing body material isapplied to zones G2 of the carrier assemblage 1000. Preferably, theamount of housing body material applied to the zones G2 is such that,after curing, the housing body material terminates vertically flush bothwith the connection locations A1, A2 of the later base body 100 and witha ring-shaped cylinder ring M formed by the carrier assemblage 1000. Inthe carrier assemblage 1000, the connection locations A1, A2 and alsothe cylinder ring M form elevations in comparison with the surface ofthe zone G2. The cylinder ring M has an outer radius R₁ of 180 to 220μm, preferably of 200 μm, an inner radius R₂ having dimensions ofbetween 80 and 120 μm, preferably of 100 μm.

Preferably, after potting, the zone G1 enclosed by the cylinder ring Min a circular fashion remains free of the housing body material. In anext step, after curing of the housing body material to form the housingbody 6, the carrier assemblage 1000 can be singulated into individualbase bodies 100 along a cutting line S. After the singulation along thecutting line S, the second region 4B of the point of inspection 4 of anindividual metallic carrier 101 in each case arises at the locations ofthe zone G2. In other words, the cylinder ring M is segmented by thesingulation process, such that, after singulation, each metallic carrier101 in each case has the indentations 5 in the form of“cylinder-segment-like” depressions.

FIG. 4 shows, in a plan view from the underside, a further exemplaryembodiment of an electronic device EBT described here. In the presentcase, the base body 100 is formed with a ceramic material, wherein thebase body 100 has connection locations A1 and A2 in this case, too. Theconnection locations A1, A2 can be formed with a metallic material, forexample, with a metallic coating formed with silver or gold, forexample. The base body is then provided with conductor tracks andplated-through holes from the underside 1B to the top side 1A, such thatthe electronic component 2 is electrically contact-connected to theconnection locations A1, A2.

As in the preceding exemplary embodiment, the device in accordance withthe exemplary embodiment likewise has side areas 3. Furthermore, eachside area 3 once again has the point of inspection 4 having the firstregion 4A and the second region 4B, wherein the second region isembodied as an indentation 5 in the first region 4A.

In the present case, the region 4B embodied as an indentation 5 iscoated with a metallic material. This is the same material with whichthe connection locations A1, A2 are also formed.

FIG. 5 shows a ceramic carrier assemblage 1001 in a schematic plan view.The carrier assemblage 1001 has cutouts 2000 which are free of materialand filled with air, for example. Furthermore, inner walls 2001 of thecutouts 2000 have a metallic coating. The metallic coating can be formedwith gold or silver, for example. Along the cutting line S, the ceramiccarrier assemblage 1001 is singulated into individual base bodies 100.After singulation, the inner walls 2001 are externally accessible andvisible. That is to say that, after singulation, through the subdividedcutouts 2001, in each case the second region 4B of a point of inspection4 is formed in the form of indentations 5.

FIG. 6 shows, in a schematic side view, an optoelectronic apparatus 130in accordance with an exemplary embodiment described here. On a contactcarrier 110, the electronic device EBT is fitted to a surface 120 of thecontact carrier 110 on a mounting region 140. The contact carrier 110can be a printed circuit board, for example, onto which the electronicdevice EBT is mounted. In this case, the mounting region 140 is thatregion of the surface 120 of the contact carrier 110 which is inmechanical contact with the electronic device EBT at least in places.The electronic device EBT is both electrically contact-connected andmechanically connected to the contact carrier 110 by means of aconnection material A, for example, a solder or an adhesive, via theconnection locations A1 and A2. Preferably, the second region 4B of thepoint of inspection 4 is also cohesively connected to the mountingregion 140 by means of the connection material A. That is to say thatboth at an interface of connection material A/second region 4B and at aninterface of connection material A/mounting region 140, neither a gapnor an interruption nor an air inclusion, for example, is formed. Thepoint of inspection 4 is freely visible from the surface 120 of thecontact carrier 110.

Since the connection locations A1 and A2 of the device EBT applied tothe contact carrier 110 are concealed by the base body 100, theembodiments proposed here of the device EBT claimed here make itpossible, by means of the laterally freely visible points of inspection4, to ascertain whether the connection locations A1 and A2 arecohesively connected to the connection material A and the electroniccomponent is thus sufficiently electrically contact-connected to thecontact carrier 110. If the points of inspection 4 are cohesivelyconnected to the connection material A, then this likewise holds truefor the connection locations A1 and A2.

The invention is not restricted by the description on the basis of theexemplary embodiments. Rather, the invention encompasses any novelfeature and also any combination of features, which in particularincludes any combination of features in the patent claims, even if thisfeature or this combination itself is not explicitly specified in thepatent claims and the exemplary embodiments.

The invention claimed is:
 1. An electronic device, comprising: a basebody, which has a top side and an underside lying opposite the top side,wherein the base body has connection locations at its underside; and anelectronic component arranged at the top side of the base body; whereinthe base body has at least one side area having at least one point ofinspection with a first region and a second region; wherein the secondregion is embodied as an indentation in the first region; wherein thefirst region and the second region contain different materials; whereinthe base body has a metallic carrier and the metallic carrier is coveredby a radiation-opaque housing body in places so that the metalliccarrier together with the housing body forms the base body; and whereinno parts of the point of inspection are concealed or covered by thehousing body or by other components of the base body.
 2. The electronicdevice according to claim 1, wherein the second region is configured tobe wetted with a connection material to a greater extent than the firstregion.
 3. The electronic device according to claim 1, wherein thehousing body mechanically connects the metallic carrier and the at leastone point of inspection to one another.
 4. The electronic deviceaccording to claim 1, wherein at least one of the metallic carrier andthe at least one point of inspection are at least partly embedded intothe housing body.
 5. The electronic device according to claim 1, whereinthe connection locations and the at least one point of inspection areformed with the same material.
 6. The electronic device according toclaim 1, wherein the at least one side area of the base body is producedby singulation in places.
 7. The electronic device according to claim 1,wherein the first region of the at least one point of inspectioncomprises a metal.
 8. The electronic device according to claim 1,wherein the first region of the at least one point of inspectioncomprises a ceramic material.
 9. The electronic device according toclaim 1, wherein the second region of the at least one point ofinspection has a metallic coating.
 10. An optoelectronic apparatus,comprising: the electronic device according to claim 1; and a contactcarrier in electrical contact with the electronic device, wherein atleast one mounting region is formed at a surface of the contact carrier;wherein the second region of the at least one point of inspection iscohesively connected to the mounting region by a connection material;and wherein the at least one point of inspection is freely visible fromthe surface of the contact carrier.
 11. The optoelectronic apparatusaccording to claim 10, wherein the connection material comprises asolder.
 12. The electronic device according to claim 1, wherein theelectronic component is arranged at a chip mounting region at the topside of the base body.
 13. The electronic device according to claim 1,wherein the electronic component is a radiation-receiving or aradiation-emitting semiconductor chip.
 14. An electronic device,comprising: a base body, which has a top side and an underside lyingopposite the top side, wherein the base body has connection locations atits underside; and an electronic component arranged at the top side ofthe base body; wherein the base body has at least one side area havingat least one point of inspection having a first region and a secondregion; wherein the second region is embodied as an indentation in thefirst region; wherein the first region and the second region containdifferent materials; wherein the first region of the at least one pointof inspection comprises a metal or ceramic material; wherein the secondregion of the at least one point of inspection has a coating, andwherein a material of the coating is different from the material of thefirst region; wherein the coating is a thin layer on the second regionso that the second region together with the coating forms an indentationin the first region; wherein the second region is configured to bewetted with a connection material to a greater extent than the firstregion; wherein the base body has a metallic carrier and the metalliccarrier is covered by a radiation-opaque housing body in places so thatthe metallic carrier together with the housing body forms the base body;wherein the material of the coating is different from the material ofthe housing body; wherein the point of inspection is part of the sidearea of the base body so that the point of inspection is externallyaccessible and freely visible without parts of the point of inspectionbeing concealed or covered by the housing body; and wherein the firstregion of the at least one point of inspection and the housing bodyterminate flush at the side area of the base body.
 15. The electronicdevice according to claim 14, wherein the housing body mechanicallyconnects the metallic carrier and the at least one point of inspectionto one another.
 16. The electronic device according to claim 14, whereinat least one of the metallic carrier and the at least one point ofinspection are at least partly embedded into the housing body.
 17. Theelectronic device according to claim 14, wherein the connectionlocations and the at least one point of inspection are formed with thesame material.